A few weeks ago at SPIE Photonics West 2026, LASEA presented OPeraTIC as part of the talk “Micromachining upscaling from W to kW: the evolution of femtosecond laser applications.” The presentation showed how increasing femtosecond laser power can significantly boost processing efficiency while addressing the challenges associated with high-power operation.

Advanced approaches such as beam shaping and beam splitting were highlighted as key enablers for optimised performance across applications including microfluidics, aerospace, batteries, electronics, and photovoltaics. Technologies such as spatial light modulators (SLMs), dual-SLM configurations, diffractive optical elements (DOEs), multi-plane light conversion (MPLC), and Direct Laser Interference Patterning (DLIP) enable the creation of highly customised beam shapes and patterns.

The talk also addressed the complexity of managing multiple beams and high-power laser sources, highlighting expected gains in machine productivity and process precision.